Lenovo 59P5107 Datenblatt Seite 6

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Low Voltage Intel
®
Xeon
Processor at 1.60 GHz, 2.0 GHz and 2.4 GHz
Contents
6 Datasheet
16 Miscellaneous Signals+ AC Specifications.................................................................................30
17 System Bus AC Specifications (Reset Conditions) ....................................................................31
18 TAP Signal Group AC Specifications .........................................................................................31
19 BCLK Signal Quality Specifications............................................................................................39
20 Ringback Specifications for AGTL+ and Asynchronous GTL+ Buffers ......................................40
21 Ringback Specifications for TAP Buffers....................................................................................41
22 Source Synchronous (400 MHz) AGTL+ Signal Group
Overshoot/Undershoot Tolerance ..............................................................................................46
23 Source Synchronous (400 MHz) AGTL+ Signal Group
Overshoot/Undershoot Tolerance ..............................................................................................46
24 Common Clock (400 MHz) AGTL+ Signal Group
Overshoot/Undershoot Tolerance ..............................................................................................47
25 400 MHz Asynchronous GTL+, PWRGOOD, and TAP Signal Groups
Overshoot/Undershoot Tolerance ..............................................................................................47
26 Source Synchronous (533 MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance........48
27 Source Synchronous (533 MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance........48
28 Common Clock (533 MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance.................49
29 533 MHz Asynchronous GTL+, PWRGOOD, and TAP Signal Groups Overshoot/Undershoot Tol-
erance49
30 Dimensions for the Low Voltage Intel
®
Xeon
Processor
in the FC-µPGA2 Package .........................................................................................................54
31 Package Dynamic and Static Load Specifications .....................................................................56
32 Processor Mass..........................................................................................................................57
33 Processor Material Properties ....................................................................................................57
34 Pin Listing by Pin Name .............................................................................................................61
35 Pin Listing by Pin Number ..........................................................................................................70
36 Signal Definitions........................................................................................................................79
37 Processor Thermal Design Power..............................................................................................90
38 Power-On Configuration Option Pins .........................................................................................93
39 Thermal Diode Parameters ........................................................................................................97
40 Thermal Diode Interface ............................................................................................................. 97
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