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Low Voltage Intel

Xeon

™

Processor at 1.60 GHz, 2.0 GHz and 2.4 GHz

Datasheet 51

4.0 Mechanical Specifications

The Low Voltage Intel

Xeon

™

processor uses the Flip Chip Micro-Pin Grid Array (FC-µPGA2)

package technology. This includes an integrated heat spreader (IHS) mounted to a pinned substrate.

Mechanical specifications for the processor are given in this section. See Section 1.1 for

terminology definitions. Figure 23 provides a basic assembly drawing and includes the components

which make up the entire processor. Package dimensions are provided in Table 30.

The Low Voltage Intel Xeon

processor utilizes a surface mount 604-pin zero-insertion force (ZIF)

socket for installation into the baseboard. See the

604-Pin Socket Design Guidelines for further

details on the processor socket.

For Figure 25 through Figure 29, the following notes apply:

1. Unless otherwise specified, the following drawings are dimensioned in millimeters.

2. All dimensions are not tested, but are ensured by design characterization.

3. Figures and drawings labelled as “Reference Dimensions” are provided for informational

purposes only. Reference Dimensions are extracted from the mechanical design database and

are nominal dimensions with no tolerance information applied. Reference Dimensions are

NOT checked as part of the processor manufacturing process. Unless noted as such,

dimensions in parentheses without tolerances are Reference Dimensions.

4. Drawings are not to scale.

Note: This drawing is not to scale and is for reference only. The assembly applies to the Low Voltage

Intel Xeon processor in the FC-µPGA2 package.

1. Integrated Heat Spreader (IHS)

2. Processor die

3. FC-µPGA2 package

4. Land side Capacitors

5. Package Pin

Figure 23. Low Voltage Intel

Xeon

™

Processor in the FC-µPGA2 Package:

Assembly Drawing

1 2 ... 46 47 48 49 50 51 52 53 54 55 56 ... 101 102

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Lenovo 59P5107 Datenblatt Seite 51