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Low Voltage Intel
®
Xeon
Processor at 1.60 GHz, 2.0 GHz and 2.4 GHz
Datasheet 11
OEM - Original Equipment Manufacturer.
Processor core - The processor’s execution engine. All AC timing and signal integrity
specifications are to the pads of the processor core.
Retention mechanism - The support components that are mounted through the baseboard to
the chassis to provide mechanical retention for the processor and heatsink assembly.
1.2 State of Data
The data contained in this document is subject to change. It is the best information that Intel is able
to provide at the publication date of this document.
1.3 References
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
Document Intel Order Number
1
AP-485, Intel
®
Processor Identification and the CPUID Instruction 241618
IA-32 Intel
®
Architecture Software Developer's Manual
Volume I: Basic Architecture
Volume II: Instruction Set Reference
Volume III: System Programming Guide
245470
245471
245472
Low Voltage Intel
®
Xeon
Processor Thermal Design Guide 273764
604 -Pin Socket Design Guidelines
Intel
®
Xeon
Processor Specification Update 249678
Intel
®
Xeon
Processor with 512 KB L2 Cache and Intel
®
E7500 Chipset
Platform Design Guide
298649
Intel
®
Xeon
Processor with 512 KB L2 cache and Intel
®
E7500/E7501
Chipset Platform Design Guide-Addendum for Embedded Applications
273707
CK00 Clock Synthesizer/Driver Design Guidelines 249206
VRM 9.0 DC-DC Converter Design Guidelines 249205
VRM 9.1 DC-DC Converter Design Guidelines 298646
Dual Intel
®
Xeon
TM
Processor Voltage Regulator Down (VRD) Design
Guidelines
298644
ITP700 Debug Port Design Guide 249679
Intel
®
Xeon
Processor with 512 KB L2 Cache System Compatibility
Guidelines
298645
NOTES:
1. Contact your Intel representative for the latest revision of documents without order numbers.
2. The signal integrity models are in IBIS format.
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