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Low Voltage Intel
®
Xeon
Processor at 1.60 GHz, 2.0 GHz and 2.4 GHz
56 Datasheet
4.2 Processor Package Load Specifications
Table 31 provides dynamic and static load specifications for the processor IHS. These mechanical
load limits should not be exceeded during heat sink assembly, mechanical stress testing, or
standard drop and shipping conditions. The heat sink attach solutions must not induce continuous
stress onto the processor with the exception of a uniform load to maintain the heat sink-to-
processor thermal interface. It is not recommended to use any portion of the processor interposer as
a mechanical reference or load bearing surface for thermal solutions.
Figure 29. Low Voltage Intel
®
Xeon
Processor FC-µPGA2 Package:
IHS Flatness and Tilt Drawing
0. 08 0
Table 31. Package Dynamic and Static Load Specifications
Parameter Max Unit Unit
Static 50 lbf 1, 2, 3
Dynamic 50 + 1 lb * 50G input * 1.8 (AF) = 140 lbf 1, 2, 4, 5
NOTES:
1. This specification applies to a uniform compressed load.
2. This is the maximum static force that may be applied by the heatsink and clip to maintain the heatsink
and processor interface.
3. These parameters are based on design characterization and not tested.
4. Dynamic loading specifications are defined assuming a maximum duration of 11 ms.
5. The heatsink weight is assumed to be one pound. Shock input to the system during shock testing is
assumed to be 50 G’s. AF is the amplification factor.
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