Lenovo 59P5107 Datenblatt PDF herunterladen (Seite 96)

Low Voltage Intel

Xeon

™

Processor at 1.60 GHz, 2.0 GHz and 2.4 GHz

96 Datasheet

7.2.6 Bus Response During Low Power States

While in AutoHALT Power Down and Stop-Grant states, the processor may process a system bus

snoop.

When the processor is in Sleep state, the processor may not process interrupts or snoop

transactions.

7.3 Thermal Monitor

The Thermal Monitor feature helps control the processor temperature by activating the Thermal

Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The

TCC reduces processor power consumption by modulating (starting and stopping) the internal

processor core clocks. The Thermal Monitor feature must be enabled for the processor to be

operating within specifications. The temperature at which Thermal Monitor activates the thermal

control circuit is not user configurable and is not software visible. Bus traffic is snooped in the

normal manner, and interrupt requests are latched (and serviced during the time that the clocks are

on) while the TCC is active.

When the Thermal Monitor feature is enabled, and a high temperature situation exists (i.e., TCC is

active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle

specific to the processor (typically 30 to 50 percent). Frequently, clocks will not be off for more

than 3.0 microseconds when the TCC is active. Cycle times are processor speed dependent and will

decrease as processor core frequencies increase. A small amount of hysteresis has been included to

prevent rapid active/inactive transitions of the TCC when the processor temperature is near its

maximum operating temperature. Once the temperature has dropped below the maximum

operating temperature, and the hysteresis timer has expired, the TCC goes inactive and clock

modulation ceases.

With a properly designed and characterized thermal solution, it is anticipated that the TCC would

only be activated for very short periods of time when running the most power intensive

applications. The processor performance impact due to these brief periods of TCC activation is

expected to be so minor that it would be immeasurable. An under-designed thermal solution that is

not able to prevent excessive activation of the TCC in the anticipated ambient environment may

cause a noticeable performance loss, and in some cases may result in a TC that exceeds the

specified maximum temperature and may affect the long-term reliability of the processor. In

addition, a thermal solution that is significantly under-designed may not be capable of cooling the

processor even when the TCC is active continuously. Refer to the Intel

Xeon

Processor

Thermal Design Guidelines for information on designing a thermal solution.

The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and

cannot be modified. The Thermal Monitor does not require any additional hardware, software

drivers, or interrupt handling routines.

7.3.1 Thermal Diode

The processor incorporates an on-die thermal diode. A thermal sensor located on the processor may

be used to monitor the die temperature of the processor for thermal management/long term die

temperature change purposes. This thermal diode is separate from the Thermal Monitor’s thermal

sensor and cannot be used to predict the behavior of the Thermal Monitor.

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