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Electrical Specifications
24 Intel® Xeon® Processor 7400 Series Datasheet
2.11 Processor DC Specifications
The following notes apply:
• The processor DC specifications in this section are defined at the processor die and
not at the package pins unless noted otherwise.
• The notes associated with each parameter are part of the specification for that
parameter.
• Unless otherwise noted, all specifications in the tables apply to all frequencies and
cache sizes.
See Section 5 for the pin signal definitions. Most of the signals on the processor FSB
are in the AGTL+ signal group. The DC specifications for these signals are listed in
Table 2-11.
Table 2-9 through Table 2-17 list the DC specifications and are valid only while meeting
specifications for case temperature (Tcase as specified in Section 6), clock frequency,
and input voltages.
2.11.1 Flexible Motherboard Guidelines (FMB)
The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the
Intel® Xeon® Processor 7400 Series will have over certain time periods. The values
are only estimates and actual specifications for future processors may differ. Processors
may or may not have specifications equal to the FMB value in the foreseeable future.
System designers should meet the FMB values to ensure their systems will be
compatible with future processors.
Table 2-9. Voltage and Current Specifications (Sheet 1 of 3)
Symbol Parameter Min Typ Max Unit Notes
1
VID VID range 0.9000 1.4500 V 10
V
CC
V
CC
for All processors
Launch - FMB
See Table 2-10 and Figure 2-4 V 2, 3, 5, 8
V
CC_BOOT
Default V
CC
Voltage for initial
power up
1.1 V
V
VID_STEP
VID step size during a
transition
± 12.5 mV
V
VID_SHIFT
Total allowable DC load line
shift from VID steps
450 mV 9
V
TT
FSB termination voltage
(DC + AC specification)
1.045 1.100 1.155 V 7, 12
V
CCPLL
PLL supply voltage (DC + AC
specification)
1.425 1.50 1.605 V
SM_V
CC
SMBus supply voltage 3.135 3.300 3.465 V
I
CC
I
CC
for a 6-Core Intel®
Xeon® X7460 Processor
Launch - FMB
150 A 3, 4, 5, 8
I
CC
I
CC
for a Intel® Xeon®
Processor E7400 Series
Launch - FMB
130 A 3, 4, 5, 8
I
CC
I
CC
for a 4-Core Intel®
Xeon® Processor E7400
Series
Launch - FMB
130 A 3, 4, 5, 8
- Datasheet 1
- Contents 3
- Revision History 7
- 1 Introduction 9
- 1.1 Terminology 11
- Introduction 12
- 1.2 State of Data 13
- 1.3 References 13
- 2 Electrical Specifications 15
- 2.2 Decoupling Guidelines 16
- Clocking 16
- 2.3.2 PLL Power Supply 18
- Electrical Specifications 20
- Table 2-4. FSB Signal Groups 21
- Asynchronous Signals 22
- 2.9 Mixing Processors 23
- Time Duration (s) 28
- Sustained Current (A) 28
- Table 2-10. V 30
- Figure 2-4. V 31
- 2.11.2 V 33
- Overshoot Specification 33
- 2.11.3 Die Voltage Validation 33
- 2.11.4.1 DC Characteristics 34
- 2.12 AGTL+ FSB Specifications 35
- Tp = T1: BCLK[1:0] period 42
- THERMTRIP# 46
- System bus 48
- FERR#/PBE# 48
- Figure 2-22. VID Step Timings 49
- 3 Mechanical Specifications 51
- Mechanical Specifications 52
- 3.7 Processor Materials 61
- 3.8 Processor Markings 62
- Processor 63
- 4 Pin Listing 65
- (Sheet 3 of 16) 66
- (Sheet 4 of 16) 66
- (Sheet 5 of 16) 67
- (Sheet 6 of 16) 67
- (Sheet 7 of 16) 68
- (Sheet 8 of 16) 68
- (Sheet 9 of 16) 69
- (Sheet 10 of 16) 69
- (Sheet 11 of 16) 70
- (Sheet 12 of 16) 70
- (Sheet 13 of 16) 71
- (Sheet 14 of 16) 71
- (Sheet 15 of 16) 72
- (Sheet 16 of 16) 72
- (Sheet 1 of 14) 73
- (Sheet 2 of 14) 73
- (Sheet 3 of 14) 74
- (Sheet 4 of 14) 74
- (Sheet 5 of 14) 75
- (Sheet 6 of 14) 75
- (Sheet 7 of 14) 76
- (Sheet 8 of 14) 76
- (Sheet 9 of 14) 77
- (Sheet 10 of 14) 77
- (Sheet 11 of 14) 78
- (Sheet 12 of 14) 78
- (Sheet 13 of 14) 79
- (Sheet 14 of 14) 79
- Pin Listing 80
- 5 Signal Definitions 81
- FSB agents 85
- . The processor includes 86
- 6 Thermal Specifications 89
- CASE_MAX 90
- CASE (°C) 91
- = 0.431 x Power + 45 95
- Power (W) 96
- Temperature (C) 96
- 6.1.2 Thermal Metrology 97
- 6.2.2 Intel Thermal Monitor 97
- 6.2.3 Intel Thermal Monitor 2 98
- 6.2.4 On-Demand Mode 99
- 6.2.5 PROCHOT# Signal 100
- 6.2.6 FORCEPR# Signal 100
- 6.2.7 THERMTRIP# Signal 100
- 6.3.1 Introduction 101
- 6.3.1.1 T 102
- 6.3.2.1 PECI Device Address 103
- 6.3.2.2 PECI Command Support 103
- 7 Features 105
- 7.2.2.1 HALT State 106
- 7.2.2.2 Extended HALT State 106
- 7.2.3 Stop-Grant State 108
- 7.3 Enhanced Intel SpeedStep 109
- Technology 109
- Features 110
- 7.4.1 SMBus Device Addressing 111
- Transactions 112
- 7.4.3.1 Header 115
- 7.4.3.2 Processor Data 119
- 0Eh-13h 120
- 7.4.3.3 Processor Core Data 121
- Offset: 1Ah-1Bh 122
- 7.4.3.4 Cache Data 124
- Offset: 29h-2Ah 125
- 2Bh-2Ch 125
- 2Dh-2Eh 125
- 7.4.3.5 Package Data 126
- 7.4.3.6 Part Number Data 127
- 38h-3Eh 128
- 3Fh-4Ch 128
- 4Dh=54h 128
- 55h-6Eh 128
- 71h-72h 129
- 7.4.3.8 Feature Data 130
- 7.4.3.9 OD: Other Data 131
- 7.4.4 Checksums 132
- 7.4.5 Scratch EEPROM 132
- 8 Debug Tools Specifications 133
- Debug Tools Specifications 134
- 9.1 Introduction 135
- 9.2 Thermal Specifications 135
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