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Intel® Xeon® Processor 7400 Series Datasheet 51

Mechanical Specifications

3 Mechanical Specifications

The Intel® Xeon® Processor 7400 Series is packaged in a lead free FC-mPGA8 package

that interfaces with the motherboard via a mPGA604 socket. The package consists of

the processor die mounted on a substrate pin-carrier. An IHS is attached to the

package substrate and die and serves as the mating surface for processor component

thermal solutions, such as a heatsink. Figure 3-1 shows a sketch of the processor

package components and how they are assembled together.

The package components shown in Figure 3-1 include the following:

1. IHS

2. Processor die

3. FC-mPGA8 package

4. Pin-side capacitors

5. Package pin

Note: Figure 3-1 is not to scale and is for reference only. The mPGA604 socket is not shown.

3.1 Package Mechanical Drawing

The drawings include dimensions necessary to design a thermal solution for the

processor. These dimensions include:

1. Package reference with tolerances (total height, length, width, etc.)

2. IHS parallelism and tilt

3. Pin dimensions

4. Top-side and back-side component keepout dimensions

5. Reference datums

All drawing dimensions are in mm [in].

Figure 3-1. Processor Package Assembly Sketch

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Lenovo AD80582QH056003 Datenblatt Seite 51