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Intel® Xeon® Processor 7400 Series Datasheet 91
Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Section 2.11.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4. Power specifications are defined at all VIDs found in Table 2-3. The Intel® Xeon® Processor 7400 Series
may be shipped under multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1. Thermal Profile is representative of a volumetrically unconstrained platform. Please refer to Table 6-2 for
discrete points that constitute the thermal profile.
Table 6-1. Processor Thermal Specifications
Core
Frequency
Thermal Design
Power
(W)
Minimum
T
CASE (°C)
Maximum
TCASE (°C)
Notes
Intel® Xeon® X7460
Processor Launch to FMB
130 5 See Figure 6-1,Figure 6-3;
Table 6-2,Table 6-4;
1, 2, 3, 4, 5
Intel® Xeon® Processor
E7400 Series Launch to
FMB
90 5 See Figure 6-2; Table 6-3; 1, 2, 3, 4, 5
6-core Intel® Xeon®
Processor L7400 Series
Launch to FMB
65 5 See Figure 6-4; Table 6-5; 1, 2, 3, 4, 5
4-core Intel® Xeon®
Processor L7400 Series
Launch to FMB
50 5 See Figure 6-5; Table 6-6 1, 2, 3, 4, 5
Figure 6-1. Intel® Xeon® X7460 Processor Thermal Profile
30
35
40
45
50
55
60
65
70
0 10 20 30 40 50 60 70 80 90 100 110 120 130
Power (W)
Tem
p
erature
(
C
)
T
CASE
= 0.146 x Power + 45
o
C
- Datasheet 1
- Contents 3
- Revision History 7
- 1 Introduction 9
- 1.1 Terminology 11
- Introduction 12
- 1.2 State of Data 13
- 1.3 References 13
- 2 Electrical Specifications 15
- 2.2 Decoupling Guidelines 16
- Clocking 16
- 2.3.2 PLL Power Supply 18
- Electrical Specifications 20
- Table 2-4. FSB Signal Groups 21
- Asynchronous Signals 22
- 2.9 Mixing Processors 23
- Time Duration (s) 28
- Sustained Current (A) 28
- Table 2-10. V 30
- Figure 2-4. V 31
- 2.11.2 V 33
- Overshoot Specification 33
- 2.11.3 Die Voltage Validation 33
- 2.11.4.1 DC Characteristics 34
- 2.12 AGTL+ FSB Specifications 35
- Tp = T1: BCLK[1:0] period 42
- THERMTRIP# 46
- System bus 48
- FERR#/PBE# 48
- Figure 2-22. VID Step Timings 49
- 3 Mechanical Specifications 51
- Mechanical Specifications 52
- 3.7 Processor Materials 61
- 3.8 Processor Markings 62
- Processor 63
- 4 Pin Listing 65
- (Sheet 3 of 16) 66
- (Sheet 4 of 16) 66
- (Sheet 5 of 16) 67
- (Sheet 6 of 16) 67
- (Sheet 7 of 16) 68
- (Sheet 8 of 16) 68
- (Sheet 9 of 16) 69
- (Sheet 10 of 16) 69
- (Sheet 11 of 16) 70
- (Sheet 12 of 16) 70
- (Sheet 13 of 16) 71
- (Sheet 14 of 16) 71
- (Sheet 15 of 16) 72
- (Sheet 16 of 16) 72
- (Sheet 1 of 14) 73
- (Sheet 2 of 14) 73
- (Sheet 3 of 14) 74
- (Sheet 4 of 14) 74
- (Sheet 5 of 14) 75
- (Sheet 6 of 14) 75
- (Sheet 7 of 14) 76
- (Sheet 8 of 14) 76
- (Sheet 9 of 14) 77
- (Sheet 10 of 14) 77
- (Sheet 11 of 14) 78
- (Sheet 12 of 14) 78
- (Sheet 13 of 14) 79
- (Sheet 14 of 14) 79
- Pin Listing 80
- 5 Signal Definitions 81
- FSB agents 85
- . The processor includes 86
- 6 Thermal Specifications 89
- CASE_MAX 90
- CASE (°C) 91
- = 0.431 x Power + 45 95
- Power (W) 96
- Temperature (C) 96
- 6.1.2 Thermal Metrology 97
- 6.2.2 Intel Thermal Monitor 97
- 6.2.3 Intel Thermal Monitor 2 98
- 6.2.4 On-Demand Mode 99
- 6.2.5 PROCHOT# Signal 100
- 6.2.6 FORCEPR# Signal 100
- 6.2.7 THERMTRIP# Signal 100
- 6.3.1 Introduction 101
- 6.3.1.1 T 102
- 6.3.2.1 PECI Device Address 103
- 6.3.2.2 PECI Command Support 103
- 7 Features 105
- 7.2.2.1 HALT State 106
- 7.2.2.2 Extended HALT State 106
- 7.2.3 Stop-Grant State 108
- 7.3 Enhanced Intel SpeedStep 109
- Technology 109
- Features 110
- 7.4.1 SMBus Device Addressing 111
- Transactions 112
- 7.4.3.1 Header 115
- 7.4.3.2 Processor Data 119
- 0Eh-13h 120
- 7.4.3.3 Processor Core Data 121
- Offset: 1Ah-1Bh 122
- 7.4.3.4 Cache Data 124
- Offset: 29h-2Ah 125
- 2Bh-2Ch 125
- 2Dh-2Eh 125
- 7.4.3.5 Package Data 126
- 7.4.3.6 Part Number Data 127
- 38h-3Eh 128
- 3Fh-4Ch 128
- 4Dh=54h 128
- 55h-6Eh 128
- 71h-72h 129
- 7.4.3.8 Feature Data 130
- 7.4.3.9 OD: Other Data 131
- 7.4.4 Checksums 132
- 7.4.5 Scratch EEPROM 132
- 8 Debug Tools Specifications 133
- Debug Tools Specifications 134
- 9.1 Introduction 135
- 9.2 Thermal Specifications 135
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