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Intel® Xeon® Processor 7400 Series Datasheet 89
Thermal Specifications
6 Thermal Specifications
6.1 Package Thermal Specifications
The Intel® Xeon® Processor 7400 Series require a thermal solution to maintain
temperatures within its operating limits. Any attempt to operate the processor outside
these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
This section provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the Intel®
Xeon® Processor 7400 Series Thermal Mechanical Design Guide.
6.1.1 Thermal Specifications
To allow the optimal operation and long-term reliability of Intel processor-based
systems, the processor must remain within the minimum and maximum case
temperature (T
CASE
) specifications as defined by the applicable thermal profile (see
Table 6-2 and Figure 6-1 for the Intel® Xeon® X7460 Processor, Table 6-3 and
Figure 6-2 for the 6-core Intel® Xeon® Processor E7400 Series, Figure 6-3 and
Table 6-4 for the 4-core Intel® Xeon® Processor E7400 Series, and Table 6-5 and
Figure 6-4 for the 6-core Intel® Xeon® Processor L7400 Series and Table 6-6 and
Figure 6-5 for the 4-core Intel® Xeon® Processor L7400 Series). Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability
of the processor and system. For more details on thermal solution design, please refer
to the Intel® Xeon® Processor 7400 Series Thermal Mechanical Design Guide.
The Intel® Xeon® Processor 7400 Series implement a methodology for managing
processor temperatures which is intended to support acoustic noise reduction through
fan speed control and to assure processor reliability. Selection of the appropriate fan
speed is based on the relative temperature data reported by the processor’s Platform
Environment Control Interface (PECI) bus as described in Section 6.3. If the value
reported via PECI is less than TCONTROL, then the case temperature is permitted to
exceed the Thermal Profile. If the value reported via PECI is greater than or equal to
TCONTROL, then the processor case temperature must remain at or below the
temperature as specified by the thermal profile. The temperature reported over PECI is
always a negative value and represents a delta below the onset of thermal control
circuit (TCC) activation, as indicated by PROCHOT# (see Section 6.2, Processor
Thermal Features). Systems that implement fan speed control must be designed to use
this data. Systems that do not alter the fan speed only need to guarantee the case
temperature meets the thermal profile specifications.
Intel has developed a thermal profile of which can be implemented with the Intel®
Xeon® X7460 Processor to ensure adherence to Intel reliability requirements. The
Intel® Xeon® X7460 Processor Thermal Profile (see Figure 6-1; Table 6-2) is
representative of a volumetrically unconstrained thermal solution (that is, industry
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