Mechanical Specifications
54 Intel® Xeon® Processor 7400 Series Datasheet
3.2 Processor Component Keepout Zones
The processor may contain components on the substrate that define component
keepout zone requirements. A thermal and mechanical solution design must not intrude
into the required keepout zones. Decoupling capacitors are typically mounted to either
the topside or pin-side of the package substrate. All drawing dimension are in mm [in].
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