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Thermal Specifications
96 Document Number: 318080-002
Additionally, utilization of a thermal solution that does not meet the Thermal Profile will
violate the thermal specifications and may result in permanent damage to the
processor. Refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-
Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for
details on system thermal solution design, thermal profiles and environmental
considerations.
For the Quad-Core Intel® Xeon® X7350 Processor, Intel has developed a thermal
profile which must be met to ensure adherence to Intel reliability requirements. The
Thermal Profile (see Figure 6-2; Table 6-4) is representative of a volumetrically
unconstrained thermal solution (that is, industry enabled 2U heatsink). In this scenario,
it is expected that the Thermal Control Circuit (TCC) would only be activated for very
brief periods of time when running the most power intensive applications. Intel has
developed the thermal profile to allow customers to choose the thermal solution and
environmental parameters that best suit their platform implementation. Refer to the
Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon®
Processor 7300 Series Thermal / Mechanical Design Guide for details on system
thermal solution design, thermal profiles and environmental considerations.
The upper point of the thermal profile consists of the Thermal Design Power (TDP) and
the associated T
CASE
value. It should be noted that the upper point associated with
Quad-Core Intel® Xeon® X7350 Processor Thermal Profile (x = TDP and y = T
CASE_MAX
P @ TDP) represents a thermal solution design point. In actuality the processor case
temperature will not reach this value due to TCC activation (see Figure 6-2 for Quad-
Core Intel® Xeon® X7350 Processor).
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) instead of
the maximum processor power consumption. The Thermal Monitor feature is intended
to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
Section 6.2. To ensure maximum flexibility for future requirements, systems should be
designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower
power dissipation is currently planned. Thermal Monitor and Thermal Monitor 2
feature must be enabled for the processor to remain within its specifications.
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Section 2.
2. Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is
measured at maximum T
CASE
.
3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
4. These specifications are based on pre-silicon estimates and simulations. These specifications will be
updated with characterized data from silicon measurements in a future release of this document.
5. Power specifications are defined at all VIDs found in Table 2-3. The Quad-Core Intel® Xeon® E7300
Processor may be shipped under multiple VIDs for each frequency.
6. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 6-1. Quad-Core Intel® Xeon® E7300 Processor Thermal Specifications
Core
Frequency
Thermal Design
Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 80 5 See Figure 6-1;
Table 6-2;
1, 2, 3, 4, 5, 6
- Processor 7200 Series 1
- Contents 3
- 4 Document Number: 318080-002 4
- Document Number: 318080-002 5 5
- 6 Document Number: 318080-002 6
- Document Number: 318080-002 7 7
- Revision History 8
- 1 Introduction 9
- 1.1 Terminology 11
- Introduction 12
- 1.2 State of Data 13
- 1.3 References 13
- 2 Electrical Specifications 15
- Clocking 16
- 2.3.2 PLL Power Supply 17
- Electrical Specifications 18
- Table 2-4. FSB Signal Groups 21
- Asynchronous Signals 22
- 2.9 Mixing Processors 23
- CC_VTT_OUT 27
- Time Duration (s) 28
- Sustained Current (A) 28
- Table 2-10. V 30
- Load Lines 32
- Static and Transient 34
- Tolerance Load Lines 34
- Specifications 35
- 2.11.2.1 DC Characteristics 36
- 2.11.3 V 37
- Overshoot Specification 37
- Example Overshoot Waveform 38
- Tp = T1: BCLK[1:0] period 47
- THERMTRIP# 51
- Figure 2-26. VID Step Timings 54
- 3 Mechanical Specifications 57
- Mechanical Specifications 58
- 3.7 Processor Materials 67
- 3.8 Processor Markings 68
- Processor 69
- 4 Pin Listing 71
- 10 of 16) 75
- 11 of 16) 76
- 12 of 16) 76
- 13 of 16) 77
- 14 of 16) 77
- 15 of 16) 78
- 16 of 16) 78
- 1 of 14) 79
- 2 of 14) 79
- 3 of 14) 80
- 4 of 14) 80
- 5 of 14) 81
- 6 of 14) 81
- 8 of 14) 82
- 7 of 14) 82
- 9 of 14) 83
- 10 of 14) 83
- 11 of 14) 84
- 12 of 14) 84
- 13 of 14) 85
- 14 of 14) 85
- Pin Listing 86
- 5 Signal Definitions 87
- CC and BCLK have reached 92
- 6 Thermal Specifications 95
- CASE_MAX 96
- Thermal Profile 98
- = 0.162 x Power + 45 98
- Pow er (W) 100
- Temperature (C) 100
- = 0.420 x Power + 45 100
- = 0.238 x Power + 45 101
- 6.1.2 Thermal Metrology 102
- 6.2.2 Thermal Monitor 103
- 6.2.3 Thermal Monitor 2 104
- 6.2.4 On-Demand Mode 105
- 6.2.5 PROCHOT# Signal 106
- 6.2.6 FORCEPR# Signal 106
- 6.2.7 THERMTRIP# Signal 106
- 6.3.1 Introduction 107
- 6.3.2 PECI Specifications 108
- 7 Features 111
- 7.2.1 Normal State 112
- EXTENDED_HALT 113
- 7.2.3 Stop-Grant State 114
- 7.3 Enhanced Intel SpeedStep 115
- Technology 115
- Features 116
- 7.4.1 SMBus Device Addressing 117
- Transactions 118
- 7.4.3.1 Header 121
- 7.4.3.2 Processor Data 125
- 7.4.3.3 Processor Core Data 126
- 16h-19h 127
- 1Ah-1Bh 127
- Offset: 1Ch 128
- 1Dh-1Eh 128
- 1Fh-20h 128
- 7.4.3.4 Cache Data 129
- 7.4.3.5 Package Data 131
- 7.4.3.6 Part Number Data 132
- 38h-3Eh 133
- 3Fh-4Ch 133
- 4Dh=54h 133
- 55h-6Eh 134
- 71h-72h 134
- 7.4.3.8 Feature Data 135
- 7.4.3.9 Other Data 136
- 7.4.4 Checksums 137
- 7.4.5 Scratch EEPROM 137
- 8.1 Introduction 139
- 8.2 Thermal Specifications 139
- 9 Debug Tools Specifications 141
- Debug Tools Specifications 142
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