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Document Number: 318080-002 57

Mechanical Specifications

3 Mechanical Specifications

The Intel

Xeon

Processor 7200 Series and 7300 Series is packaged in a FC-mPGA6

package that interfaces with the motherboard via a mPGA604 socket. The package

consists of two processor dies mounted on a substrate pin-carrier. An IHS is attached

to the package substrate and die and serves as the mating surface for processor

component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch of the

processor package components and how they are assembled together. Refer to the

mPGA604 Socket Design Guidelines for complete details on the mPGA604 socket.

The package components shown in Figure 3-1 include the following:

1. IHS

2. Processor die

3. FC-mPGA6 package

4. Pin-side capacitors

5. Package pin

Note: Figure 3-1 is not to scale and is for reference only. The mPGA604 socket is not shown.

3.1 Package Mechanical Drawing

The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The

drawings include dimensions necessary to design a thermal solution for the processor.

These dimensions include:

1. Package reference with tolerances (total height, length, width, etc.)

2. IHS parallelism and tilt

3. Pin dimensions

4. Top-side and back-side component keepout dimensions

5. Reference datums

All drawing dimension are in mm [in].

Figure 3-1. Processor Package Assembly Sketch

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Lenovo LF80565QH0254M Datenblatt Seite 57