Lenovo LF80565QH0254M Datenblatt PDF herunterladen (Seite 3)

Document Number: 318080-002 3

Contents

1Introduction..............................................................................................................9

1.1 Terminology .....................................................................................................11

1.2 State of Data....................................................................................................13

1.3 References .......................................................................................................13

2 Electrical Specifications...........................................................................................15

2.1 Front Side Bus and GTLREF ................................................................................15

2.2 Decoupling Guidelines........................................................................................15

2.2.1 VCC

Decoupling......................................................................................16

2.2.2 VTT

Decoupling......................................................................................16

2.2.3 Front Side Bus AGTL+ Decoupling ............................................................16

2.3 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking.......................................16

2.3.1 Front Side Bus Frequency Select Signals (BSEL[2:0])..................................17

2.3.2 PLL Power Supply...................................................................................17

2.4 Voltage Identification (VID) ................................................................................17

2.5 Reserved, Unused, or Test Signals.......................................................................20

2.6 Front Side Bus Signal Groups..............................................................................20

2.7 CMOS Asynchronous and Open Drain Asynchronous Signals....................................22

2.8 Test Access Port (TAP) Connection.......................................................................22

2.9 Mixing Processors..............................................................................................23

2.10 Absolute Maximum and Minimum Ratings.............................................................23

2.11 Processor DC Specifications ................................................................................24

2.11.1 Flexible Motherboard Guidelines (FMB)......................................................25

2.11.2 Platform Environmental Control Interface (PECI) DC Specifications................35

2.11.3 VCC Overshoot Specification....................................................................37

2.11.4 AGTL+ FSB Specifications........................................................................38

2.12 Front Side Bus AC Specifications .........................................................................40

2.13 Processor AC Timing Waveforms .........................................................................45

3 Mechanical Specifications........................................................................................57

3.1 Package Mechanical Drawing...............................................................................57

3.2 Processor Component Keepout Zones...................................................................60

3.3 Package Loading Specifications ...........................................................................66

3.4 Package Handling Guidelines...............................................................................67

3.5 Package Insertion Specifications..........................................................................67

3.6 Processor Mass Specifications .............................................................................67

3.7 Processor Materials............................................................................................67

3.8 Processor Markings............................................................................................68

3.9 Processor Pin-Out Coordinates ............................................................................69

4 Pin Listing ...............................................................................................................71

4.1 Pin Assignments................................................................................................71

4.1.1 Pin Listing by Pin Name...........................................................................71

4.1.2 Pin Listing by Pin Number........................................................................79

5 Signal Definitions ....................................................................................................87

5.1 Signal Definitions. .............................................................................................87

6 Thermal Specifications ............................................................................................95

6.1 Package Thermal Specifications...........................................................................95

6.1.1 Thermal Specifications............................................................................95

6.1.2 Thermal Metrology ............................................................................... 102

6.2 Processor Thermal Features.............................................................................. 103

6.2.1 Thermal Monitor Features...................................................................... 103

6.2.2 Thermal Monitor................................................................................... 103

1 2 3 4 5 6 7 8 ... 141 142

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