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Features
118 Document Number: 318080-002
Note:
1. This addressing scheme will support up to 8 processors on a single SMBus.
7.4.2 PIROM and Scratch EEPROM Supported SMBus
Transactions
The Processor Information ROM (PIROM) responds to two SMBus packet types: Read
Byte and Write Byte. However, since the PIROM is write-protected, it will acknowledge
a Write Byte command but ignore the data. The Scratch EEPROM responds to Read
Byte and Write Byte commands. Table 7-4 diagrams the Read Byte command.
Table 7-5 diagrams the Write Byte command. Following a write cycle to the scratch
ROM, software must allow a minimum of 10 ms before accessing either ROM of the
processor.
In the tables, ‘S’ represents the SMBus start bit, ‘P’ represents a stop bit, ‘R’ represents
a read bit, ‘W’ represents a write bit, ‘A’ represents an acknowledge (ACK), and ‘///’
represents a negative acknowledge (NACK). The shaded bits are transmitted by the
Processor Information ROM or Scratch EEPROM, and the bits that aren’t shaded are
transmitted by the SMBus host controller. In the tables, the data addresses indicate 8
bits. The SMBus host controller should transmit 8 bits with the most significant bit
indicating which section of the EEPROM is to be addressed: the Processor Information
ROM (MSB = 0) or the Scratch EEPROM (MSB = 1).
Table 7-3. Memory Device SMBus Addressing
Address
(Hex)
Upper
Address
1
Device Select R/W
bits 7-4
SM_EP_A2
bit 3
SM_EP_A1
bit 2
SM_EP_A0
bit 1 bit 0
A0h/A1h1010000 X
A2h/A3h1010001 X
A4h/A5h1010010 X
A6h/A7h1010011 X
A8h/A9h1010100 X
AAh/ABh 1010 1 0 1 X
ACh/ADh1010110 X
AEh/AFh 1010 1 1 1 X
Table 7-4. Read Byte SMBus Packet
S
Slave
Addres
s
Write A
Comman
d Code
AS
Slave
Address
Read A Data /// P
17-bits 1
18-bits11 7-bits 1 1 8-bits 1 1
Table 7-5. Write Byte SMBus Packet
S Slave Address Write A Command Code ADataAP
17-bits 1
18-bits18-bits11
- Processor 7200 Series 1
- Contents 3
- 4 Document Number: 318080-002 4
- Document Number: 318080-002 5 5
- 6 Document Number: 318080-002 6
- Document Number: 318080-002 7 7
- Revision History 8
- 1 Introduction 9
- 1.1 Terminology 11
- Introduction 12
- 1.2 State of Data 13
- 1.3 References 13
- 2 Electrical Specifications 15
- Clocking 16
- 2.3.2 PLL Power Supply 17
- Electrical Specifications 18
- Table 2-4. FSB Signal Groups 21
- Asynchronous Signals 22
- 2.9 Mixing Processors 23
- CC_VTT_OUT 27
- Time Duration (s) 28
- Sustained Current (A) 28
- Table 2-10. V 30
- Load Lines 32
- Static and Transient 34
- Tolerance Load Lines 34
- Specifications 35
- 2.11.2.1 DC Characteristics 36
- 2.11.3 V 37
- Overshoot Specification 37
- Example Overshoot Waveform 38
- Tp = T1: BCLK[1:0] period 47
- THERMTRIP# 51
- Figure 2-26. VID Step Timings 54
- 3 Mechanical Specifications 57
- Mechanical Specifications 58
- 3.7 Processor Materials 67
- 3.8 Processor Markings 68
- Processor 69
- 4 Pin Listing 71
- 10 of 16) 75
- 11 of 16) 76
- 12 of 16) 76
- 13 of 16) 77
- 14 of 16) 77
- 15 of 16) 78
- 16 of 16) 78
- 1 of 14) 79
- 2 of 14) 79
- 3 of 14) 80
- 4 of 14) 80
- 5 of 14) 81
- 6 of 14) 81
- 8 of 14) 82
- 7 of 14) 82
- 9 of 14) 83
- 10 of 14) 83
- 11 of 14) 84
- 12 of 14) 84
- 13 of 14) 85
- 14 of 14) 85
- Pin Listing 86
- 5 Signal Definitions 87
- CC and BCLK have reached 92
- 6 Thermal Specifications 95
- CASE_MAX 96
- Thermal Profile 98
- = 0.162 x Power + 45 98
- Pow er (W) 100
- Temperature (C) 100
- = 0.420 x Power + 45 100
- = 0.238 x Power + 45 101
- 6.1.2 Thermal Metrology 102
- 6.2.2 Thermal Monitor 103
- 6.2.3 Thermal Monitor 2 104
- 6.2.4 On-Demand Mode 105
- 6.2.5 PROCHOT# Signal 106
- 6.2.6 FORCEPR# Signal 106
- 6.2.7 THERMTRIP# Signal 106
- 6.3.1 Introduction 107
- 6.3.2 PECI Specifications 108
- 7 Features 111
- 7.2.1 Normal State 112
- EXTENDED_HALT 113
- 7.2.3 Stop-Grant State 114
- 7.3 Enhanced Intel SpeedStep 115
- Technology 115
- Features 116
- 7.4.1 SMBus Device Addressing 117
- Transactions 118
- 7.4.3.1 Header 121
- 7.4.3.2 Processor Data 125
- 7.4.3.3 Processor Core Data 126
- 16h-19h 127
- 1Ah-1Bh 127
- Offset: 1Ch 128
- 1Dh-1Eh 128
- 1Fh-20h 128
- 7.4.3.4 Cache Data 129
- 7.4.3.5 Package Data 131
- 7.4.3.6 Part Number Data 132
- 38h-3Eh 133
- 3Fh-4Ch 133
- 4Dh=54h 133
- 55h-6Eh 134
- 71h-72h 134
- 7.4.3.8 Feature Data 135
- 7.4.3.9 Other Data 136
- 7.4.4 Checksums 137
- 7.4.5 Scratch EEPROM 137
- 8.1 Introduction 139
- 8.2 Thermal Specifications 139
- 9 Debug Tools Specifications 141
- Debug Tools Specifications 142
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