Lenovo LF80565QH0254M Datenblatt PDF herunterladen (Seite 67)

Document Number: 318080-002 67

Mechanical Specifications

3.4 Package Handling Guidelines

Table 3-2 includes a list of guidelines on package handling in terms of recommended

maximum loading on the processor IHS relative to a fixed substrate. These package

handling loads may be experienced during heatsink removal.

3.5 Package Insertion Specifications

The Intel

Xeon

Processor 7200 Series and 7300 Series can be inserted into and

removed from a mPGA604 socket 15 times. The socket should meet the mPGA604

requirements detailed in the mPGA604 Socket Design Guidelines.

3.6 Processor Mass Specifications

The typical mass of the Intel

Xeon

Processor 7200 Series and 7300 Series is 37.6 g

(1.5oz). This mass [weight] includes all the components that are included in the

package.

3.7 Processor Materials

Table 3-3 lists some of the package components and associated materials.

Table 3-2. Package Handling Guidelines

Parameter Maximum Recommended Notes

Shear 356 N [80 lbf]

Notes:

1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

2. These guidelines are based on limited testing for design characterization.

Tensile 156 N [35 lbf]

3. A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.

Torque 8 N-m [70 lbf-in]

4. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top

surface.

Table 3-3. Processor Materials

Component Material

Integrated Heat Spreader (IHS) Nickel Plated Copper

Substrate Fiber-Reinforced Resin

Substrate Pins Gold Plated Copper

1 2 ... 62 63 64 65 66 67 68 69 70 71 72 ... 141 142

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Lenovo LF80565QH0254M Datenblatt Seite 67