Lenovo HS22 Betriebsanweisung PDF herunterladen (Seite 17)

Versatile, easy-to-use blade optimized for performance, energy and cooling

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17.

BladeCenter HS22 Specifications

2.26GHz L5640 (N2x),

2.4GHz E5645 (CTO),

2.53GHz E5649 (B6x),

2.66GHz X5650 (H2x/HAx),

2.93GHz X5670 (H4x),

3.06GHz x5675 (C6x),

3.33GHz X5680 (F2x),

3.46GHz X5677 (F3x) ,

3.46GHz X5690 (C8x)

1.86GHz L5609 (CTO),

1.86GHz L5618 (spec bid),

2.13GHz E5606 (CTO),

2.26GHz E5607 (A7x),

2.40GHz E5620 (G2x),

2.66GHz E5640 (G4x),

2.93GHz X5647 (B5x),

3.06GHz X5667 (H5x),

3.2GHz X5672 (C5x),

3.6GHz X5687 (C7x)

Four-core Xeon

(E55xx)

2.26GHz E5507 (A4x)

Processor power draw

130W (B5x,

C7x/C8x,

F2x/F3x)

95W (C5x/C6x,

H2x/H4x/H5x/

HAx)

80W

(A4x/A5x/A7x,

B6x, D3x,

G2x/G4x/ GCx,

plus

E5606/E5645

via CTO)

60W (N2x,

plus L5630 via

CTO)

40W (L5609.

L5618 via

CTO)

Internal cache

12MB shared cache (A5x/A7x, B5x/B6x,

C5x/C6x/C7x/C8x, F2x/F3x, G2x/G4x/GCx,

H2x/H4x/H5x/HAx, N2x, plus E5645,

L5609/L5618/L5630, viq CTO)

4MB shared cache (A4x/A5x/A7x, D3x,

plus E5606 via CTO)

QuickPath Interconnect (QPI) speed

(gigatransfers per second)

6.4 GTps (B6x, C5x/C6x/

C7x/C8x, F2x/F3x,

H2x/H4x/H5x/HAx)

5.86 GTps (A5x/A7x, B5x,

G2x/G4x/GCx, N2x, plus

E5606/E5645, L5630 via

CTO)

4.8 GTps (A4x/A5x/A7x,,

D3x, plus E5606 via CTO)

Maximum memory access speed

1333MHz (B6x, C5x/C6x/

C7x/C8x, F2x/F3x,

H2x/H4x/H5x/HAx, N2x,

plus E5645, L5630 via

CTO)

1066MHz (A5x/A7x, B5x,

G2x/G4x/GCx, plus E5606,

L5609/L5618)

800MHz (A4x/A5x/A7x,

D3x, plus E5606 via CTO)

# of processors standard /

maximum

1 / 2

NEBS/ETSI Compliance Select blades are NEBS3/ETSI-compliant. (Contact IBM sales for details.)

Chipset Intel 5520

Standard / maximum memory

12GB (3 x 4GB) /

288GB (B5x/B6x,

C5x/C6x/C7x/C8x)

6GB (3 x 2GB) /

192GB (F2x/F3x,

G2x/G4x/GCx,

H2x/H4x/H5x/HAx,

N2x)

4GB (1 x 4GB) /

288GB (A5x/A7x)

3GB (3 x 1GB) /

192GB (A4x, D3x)

Standard memory type

Registered DDR3 ECC (operating at 1333MHz, 1066MHz or 800MHz, depending on

processor and memory configuration)

Memory interleaving Yes

DIMM capacities supported 1GB, 2GB, 4GB, 8GB (when available)

Chipkill protection supported Yes (using x4 DIMMs)

# of DIMM sockets total / available 12 / 9

# of 2.5-inch drive bays total /

available

2 / 2 SAS/SATA/SSD

# of 3.5-inch drive bays total /

available

None

Maximum internal 2.5" HDD

capacity

Standard

1.2TB (2 x 600GB) hot-swap

Maximum memory and disk capacity may require the replacement of standard components with the largest supported component available.

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