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Document Number: 318080-002 99
Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Section 2.
2. Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is
measured at maximum T
CASE
.
3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
4. These specifications are based on initial silicon characterization. These specifications may be further
updated as more characterization data becomes available.
5. Power specifications are defined at all VIDs found in Table 2-3. The Quad-Core Intel® Xeon® L7345
Processor may be shipped under multiple VIDs for each frequency.
6. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 6-4. Quad-Core Intel® Xeon® X7350 Processor Thermal Profile Table
Power (W) T
CASE_MAX
(° C)
0 45.0
10 46.6
20 48.2
30 49.9
40 51.5
50 53.1
60 54.7
70 56.3
80 58.0
90 59.6
100 61.2
110 62.8
120 64.4
130 66.0
Table 6-5. Quad-Core Intel® Xeon® L7345 Processor Thermal Specifications
Core
Frequency
Thermal Design
Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 50 5 See Figure 6-3;
Table 6-6
1, 2, 3, 4, 5, 6
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