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Electrical Specifications
26 Document Number: 318080-002
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processors and are based on estimates
and simulations, not empirical data. These specifications will be updated with characterized data from
silicon measurements at a later date.
2. These voltages are targets only. A variable voltage source should exist on systems in the event that a
different voltage is required. See Section 2.4 for more information.
3. The voltage specification requirements are measured across the VCC_SENSE and VSS_SENSE pins and
across the VCC_SENSE2 and VSS_SENSE2 pins with an oscilloscope set to 100 MHz bandwidth, 1.5 pF
maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the
probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe.
4. The processor must not be subjected to any static V
CC
level that exceeds the V
CC_MAX
associated with any
particular current. Failure to adhere to this specification can shorten processor lifetime.
5. I
CC_MAX
specification is based on maximum V
CC
loadline Refer to Figure 2-10 for details. The processor is
capable of drawing I
CC_MAX
for up to 10 ms. Refer to Figure 2-9 for further details on the average processor
current draw over various time durations.
6. FMB is the flexible motherboard guideline. These guidelines are for estimation purposes only. See
Section 2.11.1 for further details on FMB guidelines.
7. This specification represents the total current for GTLREF_DATA_MID, GTLREF_DATA_END,
GTLREF_ADD_MID, and GTLREF_ADD_END.
8. V
TT
must be provided via a separate voltage source and must not be connected to V
CC
. This specification is
measured at the pin.
I
TT
I
CC
for V
TT
supply before V
CC
stable
I
CC
for V
TT
supply after V
CC
stable
8.0
7.0
A15
I
CC_TDC
Thermal Design Current (TDC) Quad-
Core Intel® Xeon® L7345 Processor
Launch - FMB
50 A 6,14
I
CC_TDC
Thermal Design Current (TDC) Dual-
Core Intel® Xeon® Processor 7200
Series
Launch - FMB
75 A 6,14
I
CC_TDC
Thermal Design Current (TDC) Intel
®
Xeon
®
Processor 7200 Series and 7300
Series
Launch - FMB
75 A 6,14
I
CC_TDC
Thermal Design Current (TDC) Intel®
Xeon® X7350 Processor
Launch - FMB
110 A 6,14
I
CC_VTT_OUT
DC current that may be drawn from
V
TT_OUT
per pin
580 mA 16
I
CC_GTLREF
I
CC
for
GTLREF_DATA_MID,
GTLREF_DATA_END,
GTLREF_ADD_MID, and
GTLREF_ADD_END
200 µA 7
I
CC_VCCPLL
I
CC
for PLL supply 260 mA 12
I
TCC
I
CC
for Quad-Core Intel® Xeon® L7345
Processor during active thermal control
circuit (TCC)
60 A
I
TCC
I
CC
for Dual-Core Intel® Xeon®
Processor 7200 Series during active
thermal control circuit (TCC)
90 A
I
TCC
I
CC
for Dual-Core Intel® Xeon®
Processor 7200 Series and Quad-Core
Intel® Xeon® Processor 7300 Series
during active thermal control circuit
(TCC)
90 A
I
TCC
I
CC
for Intel® Xeon® X7350 Processor
during active thermal control circuit
(TCC)
130 A
Table 2-9. Voltage and Current Specifications (Sheet 2 of 2)
Symbol Parameter Min Typ Max Unit
Notes
1,17
- Processor 7200 Series 1
- Contents 3
- 4 Document Number: 318080-002 4
- Document Number: 318080-002 5 5
- 6 Document Number: 318080-002 6
- Document Number: 318080-002 7 7
- Revision History 8
- 1 Introduction 9
- 1.1 Terminology 11
- Introduction 12
- 1.2 State of Data 13
- 1.3 References 13
- 2 Electrical Specifications 15
- Clocking 16
- 2.3.2 PLL Power Supply 17
- Electrical Specifications 18
- Table 2-4. FSB Signal Groups 21
- Asynchronous Signals 22
- 2.9 Mixing Processors 23
- CC_VTT_OUT 27
- Time Duration (s) 28
- Sustained Current (A) 28
- Table 2-10. V 30
- Load Lines 32
- Static and Transient 34
- Tolerance Load Lines 34
- Specifications 35
- 2.11.2.1 DC Characteristics 36
- 2.11.3 V 37
- Overshoot Specification 37
- Example Overshoot Waveform 38
- Tp = T1: BCLK[1:0] period 47
- THERMTRIP# 51
- Figure 2-26. VID Step Timings 54
- 3 Mechanical Specifications 57
- Mechanical Specifications 58
- 3.7 Processor Materials 67
- 3.8 Processor Markings 68
- Processor 69
- 4 Pin Listing 71
- 10 of 16) 75
- 11 of 16) 76
- 12 of 16) 76
- 13 of 16) 77
- 14 of 16) 77
- 15 of 16) 78
- 16 of 16) 78
- 1 of 14) 79
- 2 of 14) 79
- 3 of 14) 80
- 4 of 14) 80
- 5 of 14) 81
- 6 of 14) 81
- 8 of 14) 82
- 7 of 14) 82
- 9 of 14) 83
- 10 of 14) 83
- 11 of 14) 84
- 12 of 14) 84
- 13 of 14) 85
- 14 of 14) 85
- Pin Listing 86
- 5 Signal Definitions 87
- CC and BCLK have reached 92
- 6 Thermal Specifications 95
- CASE_MAX 96
- Thermal Profile 98
- = 0.162 x Power + 45 98
- Pow er (W) 100
- Temperature (C) 100
- = 0.420 x Power + 45 100
- = 0.238 x Power + 45 101
- 6.1.2 Thermal Metrology 102
- 6.2.2 Thermal Monitor 103
- 6.2.3 Thermal Monitor 2 104
- 6.2.4 On-Demand Mode 105
- 6.2.5 PROCHOT# Signal 106
- 6.2.6 FORCEPR# Signal 106
- 6.2.7 THERMTRIP# Signal 106
- 6.3.1 Introduction 107
- 6.3.2 PECI Specifications 108
- 7 Features 111
- 7.2.1 Normal State 112
- EXTENDED_HALT 113
- 7.2.3 Stop-Grant State 114
- 7.3 Enhanced Intel SpeedStep 115
- Technology 115
- Features 116
- 7.4.1 SMBus Device Addressing 117
- Transactions 118
- 7.4.3.1 Header 121
- 7.4.3.2 Processor Data 125
- 7.4.3.3 Processor Core Data 126
- 16h-19h 127
- 1Ah-1Bh 127
- Offset: 1Ch 128
- 1Dh-1Eh 128
- 1Fh-20h 128
- 7.4.3.4 Cache Data 129
- 7.4.3.5 Package Data 131
- 7.4.3.6 Part Number Data 132
- 38h-3Eh 133
- 3Fh-4Ch 133
- 4Dh=54h 133
- 55h-6Eh 134
- 71h-72h 134
- 7.4.3.8 Feature Data 135
- 7.4.3.9 Other Data 136
- 7.4.4 Checksums 137
- 7.4.5 Scratch EEPROM 137
- 8.1 Introduction 139
- 8.2 Thermal Specifications 139
- 9 Debug Tools Specifications 141
- Debug Tools Specifications 142
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