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Document Number: 318080-002 25
Electrical Specifications
2.11.1 Flexible Motherboard Guidelines (FMB)
The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the
Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon®
Processor 7300 Series will have over certain time periods. The values are only
estimates and actual specifications for future processors may differ. Processors may or
may not have specifications equal to the FMB value in the foreseeable future. System
designers should meet the FMB values to ensure their systems will be compatible with
future processors.
Table 2-9. Voltage and Current Specifications (Sheet 1 of 2)
Symbol Parameter Min Typ Max Unit
Notes
1,17
VID VID range 1.0000 1.5000 V
V
CC
V
CC
for processor core
Launch - FMB
See Table 2-10, Figure 2-5,
Figure 2-6 and Figure 2-7
V 2, 3, 4, 6,
9
V
CC_BOOT
Default V
CC
Voltage for initial power up 1.10 V 2
V
VID_STEP
VID step size during a transition ± 12.5 mV
V
VID_SHIFT
Total allowable DC load line shift from
VID steps
450 mV 10
V
TT
FSB termination voltage (DC + AC
specification)
1.14 1.20 1.26 V 8, 13
V
CCPLL
PLL supply voltage (DC + AC
specification)
1.425 1.50 1.605 V
SM_VCC SMBus supply voltage 3.135 3.300 3.465 V
I
CC
I
CC
for Quad-Core Intel® Xeon® L7345
Processor with multiple VID
Launch - FMB
60 A 4, 5, 6, 9
I
CC_RESET
I
CC_RESET
for Quad-Core Intel® Xeon®
L7345 Processor with multiple VID
Launch - FMB
60 A 17
I
CC
I
CC
for Dual-Core Intel® Xeon®
Processor 7200 Series with multiple
VID
Launch - FMB
90 A 4, 5, 6, 9
I
CC_RESET
I
CC_RESET
for Dual-Core Intel® Xeon®
Processor 7200 Series with multiple
VID
Launch - FMB
90 A 17
I
CC
I
CC
for Intel
®
Xeon
®
Processor 7200
Series and 7300 Series with multiple
VID
Launch - FMB
90 A 4, 5, 6, 9
I
CC_RESET
I
CC_RESET
for Intel
®
Xeon
®
Processor
7200 Series and 7300 Series with
multiple VID
Launch - FMB
90 A 17
I
CC
I
CC
for Intel® Xeon® X7350 Processor
with multiple VID
Launch - FMB
130 A 4, 5, 6, 9
I
CC_RESET
I
CC_RESET
for Intel® Xeon® X7350
Processor with multiple VID
Launch - FMB
130 A 17
I
SM_VCC
Icc for SMBus supply 100 122.5 mA
- Processor 7200 Series 1
- Contents 3
- 4 Document Number: 318080-002 4
- Document Number: 318080-002 5 5
- 6 Document Number: 318080-002 6
- Document Number: 318080-002 7 7
- Revision History 8
- 1 Introduction 9
- 1.1 Terminology 11
- Introduction 12
- 1.2 State of Data 13
- 1.3 References 13
- 2 Electrical Specifications 15
- Clocking 16
- 2.3.2 PLL Power Supply 17
- Electrical Specifications 18
- Table 2-4. FSB Signal Groups 21
- Asynchronous Signals 22
- 2.9 Mixing Processors 23
- CC_VTT_OUT 27
- Time Duration (s) 28
- Sustained Current (A) 28
- Table 2-10. V 30
- Load Lines 32
- Static and Transient 34
- Tolerance Load Lines 34
- Specifications 35
- 2.11.2.1 DC Characteristics 36
- 2.11.3 V 37
- Overshoot Specification 37
- Example Overshoot Waveform 38
- Tp = T1: BCLK[1:0] period 47
- THERMTRIP# 51
- Figure 2-26. VID Step Timings 54
- 3 Mechanical Specifications 57
- Mechanical Specifications 58
- 3.7 Processor Materials 67
- 3.8 Processor Markings 68
- Processor 69
- 4 Pin Listing 71
- 10 of 16) 75
- 11 of 16) 76
- 12 of 16) 76
- 13 of 16) 77
- 14 of 16) 77
- 15 of 16) 78
- 16 of 16) 78
- 1 of 14) 79
- 2 of 14) 79
- 3 of 14) 80
- 4 of 14) 80
- 5 of 14) 81
- 6 of 14) 81
- 8 of 14) 82
- 7 of 14) 82
- 9 of 14) 83
- 10 of 14) 83
- 11 of 14) 84
- 12 of 14) 84
- 13 of 14) 85
- 14 of 14) 85
- Pin Listing 86
- 5 Signal Definitions 87
- CC and BCLK have reached 92
- 6 Thermal Specifications 95
- CASE_MAX 96
- Thermal Profile 98
- = 0.162 x Power + 45 98
- Pow er (W) 100
- Temperature (C) 100
- = 0.420 x Power + 45 100
- = 0.238 x Power + 45 101
- 6.1.2 Thermal Metrology 102
- 6.2.2 Thermal Monitor 103
- 6.2.3 Thermal Monitor 2 104
- 6.2.4 On-Demand Mode 105
- 6.2.5 PROCHOT# Signal 106
- 6.2.6 FORCEPR# Signal 106
- 6.2.7 THERMTRIP# Signal 106
- 6.3.1 Introduction 107
- 6.3.2 PECI Specifications 108
- 7 Features 111
- 7.2.1 Normal State 112
- EXTENDED_HALT 113
- 7.2.3 Stop-Grant State 114
- 7.3 Enhanced Intel SpeedStep 115
- Technology 115
- Features 116
- 7.4.1 SMBus Device Addressing 117
- Transactions 118
- 7.4.3.1 Header 121
- 7.4.3.2 Processor Data 125
- 7.4.3.3 Processor Core Data 126
- 16h-19h 127
- 1Ah-1Bh 127
- Offset: 1Ch 128
- 1Dh-1Eh 128
- 1Fh-20h 128
- 7.4.3.4 Cache Data 129
- 7.4.3.5 Package Data 131
- 7.4.3.6 Part Number Data 132
- 38h-3Eh 133
- 3Fh-4Ch 133
- 4Dh=54h 133
- 55h-6Eh 134
- 71h-72h 134
- 7.4.3.8 Feature Data 135
- 7.4.3.9 Other Data 136
- 7.4.4 Checksums 137
- 7.4.5 Scratch EEPROM 137
- 8.1 Introduction 139
- 8.2 Thermal Specifications 139
- 9 Debug Tools Specifications 141
- Debug Tools Specifications 142
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