Lenovo AD80582QH056003 Datenblatt Seite 92

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Thermal Specifications
92 Intel® Xeon® Processor 7400 Series Datasheet
2. Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile will result in increased probability of TCC
activation and may incur measurable performance loss. (See Section 6.2 for details on TCC activation).
3. Refer to the Intel® Xeon® Processor 7400 Series Thermal Mechanical Design Guide for system and
environmental implementation details.
Notes:
1. Thermal Profile is representative of a volumetrically unconstrained platform.
2. Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile will result in increased probability of TCC
activation and may incur measurable performance loss. (See Section 6.2 for details on TCC activation).
3. Refer to the Intel® Xeon® Processor 7400 Series Thermal Mechanical Design Guide for system and
environmental implementation details.
Table 6-2. Intel® Xeon® X7460 Processor Thermal Profile Table
Power (W) T
CASE_MAX
(°C)
045
10 46.5
20 47.9
30 49.4
40 50.8
50 52.3
60 53.8
70 55.2
80 56.7
90 58.2
100 59.6
110 61.1
120 62.5
130 64
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