Lenovo AD80582QH056003 Datenblatt Seite 4

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4 Intel® Xeon® Processor 7400 Series Datasheet
6.2 Processor Thermal Features ................................................................................97
6.2.1 Intel® Thermal Monitor Features..............................................................97
6.2.2 Intel Thermal Monitor..............................................................................97
6.2.3 Intel Thermal Monitor 2...........................................................................98
6.2.4 On-Demand Mode...................................................................................99
6.2.5 PROCHOT# Signal ................................................................................100
6.2.6 FORCEPR# Signal .................................................................................100
6.2.7 THERMTRIP# Signal..............................................................................100
6.3 Platform Environment Control Interface (PECI) ....................................................101
6.3.1 Introduction.........................................................................................101
6.3.1.1 TCONTROL and Tcc Activation on PECI-Based Systems.................102
6.3.1.2 Processor Thermal Data Sample Rate and Filtering.......................102
6.3.2 PECI Specifications ...............................................................................103
6.3.2.1 PECI Device Address................................................................103
6.3.2.2 PECI Command Support...........................................................103
6.3.2.3 PECI Fault Handling Requirements.............................................103
6.3.2.4 PECI GetTemp0() and GetTemp1() Error Code Support.................104
7Features................................................................................................................105
7.1 Power-On Configuration Options ........................................................................105
7.2 Clock Control and Low Power States...................................................................105
7.2.1 Normal State .......................................................................................106
7.2.2 HALT or Extended HALT State.................................................................106
7.2.2.1 HALT State.............................................................................106
7.2.2.2 Extended HALT State...............................................................106
7.2.3 Stop-Grant State ..................................................................................108
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant
Snoop State.........................................................................................109
7.2.4.1 HALT Snoop State, Stop Grant Snoop State ................................109
7.2.4.2 Extended HALT Snoop State .....................................................109
7.3 Enhanced Intel SpeedStep® Technology.............................................................109
7.4 System Management Bus (SMBus) Interface .......................................................110
7.4.1 SMBus Device Addressing ......................................................................111
7.4.2 PIROM and Scratch EEPROM Supported SMBus Transactions.......................112
7.4.3 Processor Information ROM (PIROM) .......................................................113
7.4.3.1 Header ..................................................................................115
7.4.3.2 Processor Data........................................................................119
7.4.3.3 Processor Core Data ................................................................121
7.4.3.4 Cache Data ............................................................................124
7.4.3.5 Package Data .........................................................................126
7.4.3.6 Part Number Data ...................................................................127
7.4.3.7 Thermal Reference Data...........................................................129
7.4.3.8 Feature Data ..........................................................................130
7.4.3.9 OD: Other Data.......................................................................131
7.4.4 Checksums ..........................................................................................132
7.4.5 Scratch EEPROM...................................................................................132
8 Debug Tools Specifications ....................................................................................133
8.1 Debug Port System Requirements......................................................................133
8.2 Logic Analyzer Interface (LAI) ...........................................................................133
8.2.1 Mechanical Considerations .....................................................................133
8.2.2 Electrical Considerations........................................................................134
9 Boxed Processor Specifications..............................................................................135
9.1 Introduction....................................................................................................135
9.2 Thermal Specifications......................................................................................135
9.2.1 Boxed Processor Cooling Requirements....................................................135
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